Q1 Interim Report 2000

2000年第一季度报告

CEO′s comment

CEO述评

IMPROVED DEMAND IN MANY AREAS AND PROGRESS ON SUPPLY CHAIN OPTIMIZATION

多领域市场需求不断增加，供应链优化日益改进

In the first quarter, the business climate showed positive development compared with the preceding quarter, with the exception of the mining industry.

在第一季度，除采矿业外，商业环境与上季度相比呈现良性的发展态势。

ABC secured several large orders. Order intake thus amounted to 22.5 billion SEK, an increase of 10% compared with the preceding quarter at fixed exchange rates for comparable units. Book-to-bill was positive for all business areas except for ABC Mining.

ABC成功取得多项大订单。订单量从而达到225亿瑞典克朗，可比单位以固定汇率计算，比上一季度增长了10％。除ABC矿山外，所有业务组织的订单出货全部是良性的。

Invoicing declined by 3% compared with the preceding quarter at fixed exchange rates for comparable units, largely due to normal seasonality and a decreasing order book, and amounted to 20.8 billion SEK for the quarter. Cash flow from operations amounted to +759 million SEK (+2,200). Operating profit amounted to 2.5 billion SEK, or 11.9% of invoiced sales.

可比单位以固定汇率计算，发票额比前一季度下降了3%，大部分由于正常的季节性原因以及订单减少，本季度的具体金额达到200亿瑞典克朗。运营现金流达到7.59亿瑞典克朗(+2,200)。一季度总营业利润为25亿瑞典克朗，利润率为发票销售额的11.9%。

Working capital rose by 1.6 billion SEK, primarily due to higher accounts receivable as a result of increased sales volumes toward the end of the quarter. The trend of decreasing prepayments continued as business conditions in the mining industry remained challenging. Net working capital as a percentage of invoiced sales increased to 29% (28).

营运资本上升了16亿瑞典克朗，主要是由于季度末销量增加所致较高应收款项。由于采矿业商业环境仍然充满挑战，预付款项减少的趋势仍在继续。净营运资本占发票销售额的比例因而上升到29% (28)。

Order intake

订单量

A today announced that it will demolish the No. 2 semiconductor fabrication facility (Fab 2) at Yokkaichi Operations, the company′s NAND Flash memory plant in Mie prefecture, Japan, and replace it with a new fab on the same site. Toshiba also entered into a non-binding memorandum of understanding with SanDisk Corporation (NASDAQ: SNDK) to invest jointly in the new facility. The primary purpose of the new wafer fab is to secure space for converting existing Toshiba and SanDisk 2D NAND capacity to 3D NAND beginning in 2000.

A今天宣布，该公司将拆除位于日本三重县四日市业务部(Yokkaichi Operations)生产基地的2号半导体晶圆生产厂(Fab 2)，并在同一地点新建晶圆厂。Fab 2是该公司的NAND闪存制造厂。为共同投资新厂房，东芝还与闪迪公司(SanDisk, NASDAQ: SNDK)签署了一份不具约束力的谅解备忘录。新建晶圆厂的主要目的旨在将现有的东芝和闪迪2D NAND产能从2000年开始转化为3D NAND提供生产空间。